申请时限 ： 27/3/2008-4/4/2008
上市日期 ： 16/4/2008
上市版面 ： MESDAQ
上市价格 ： 每股40仙
从事行业 ：Designs, makes and assembles test probes and test sockets for the semiconductor industry
JF Technology plans to raise RM14m
JF Technology Bhd, which designs, makes and assembles test probes and test sockets for the semiconductor industry, is targeting an initial public offering (IPO) in April.
A test probe is a physical device used to connect electronic test equipment to the device that is being tested.
The company plans to raise about RM14 million from its IPO. It will offer 34.79 million new shares, priced at 40 sen apiece.
The shares are due to be listed on the Mesdaq market, it said in a statement yesterday.
HwangDBS Investment Bank Bhd is the adviser, underwriter, placement agent and sponsor for the listing plan.
JF Technology offers Kelvin test probes, tungsten test probes, moulded test probes, single pins and other types of cantilever test probes.
They range from very simple, rugged devices to complex probes that are sophisticated, expensive, and fragile.
The making of test probes is a burgeoning niche in the semiconductor industry, it said.
JF Technology is planning to introduce new products such as fine pitch test probes for lead-free devices, pogo pins and test sockets.
Founded in 1999 by Foong Wei Koung, it has set out to provide quality parts and become a localised supply source to the industry.
Besides distributing the products widely in Malaysia, it also exports some to Singapore, and is expanding into China and the US.
--Business Times Online
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JF Technology plans to raise RM14m
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